Qplast™
QPHD G760
High Density Polyethylene
Qplast™ QPHD G760 is a high-density polyethylene (HDPE) resin designed as a versatile polymer for manufacturing containers for dairy, water, and fruit beverages. It is also suitable for blow molding into various thin-walled components and household items.
- Supplier
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Applications
Beverage Packaging
Houseware Items
Thin-walled parts
Resin Properties
Typical Value (English) |
Typical Value (SI) |
Test Method |
|
---|---|---|---|
Density | 0.961 g/cm³ |
0.961 g/cm³ | ASTM D792 |
Melt Index (190°C/2.16 kg) | 0.79 g/10 min |
0.79 g/10 min | ASTM D1238 |
High Load Melt Index (190°C/21.6 kg) | 57 g/10 min |
57 g/10 min | ASTM D1238 |
Melting Temperature | 271 °F |
133 °C | Proprietary Method |
Molded Properties
Tensile Strength at Yield | 4600 psi |
31.7 MPa | ASTM D638 |
Tensile Strength at Break | 3500 psi |
24.1 MPa | ASTM D638 |
Elongation at Yield | 7 % |
7 % | ASTM D638 |
Elongation at Break | 1000 % |
1000 % | ASTM D638 |
Flexural Modulus — 2% Secant | 185000 psi |
1276 MPa | ASTM D790B |
Environmental Stress-Cracking Resistance (ESCR) 122°F (50 °C), 100% Igepal, F50 |
20 hr |
20 hr | ASTM D1693 |
Durometer Hardness (Shore D) | 66 |
66 | ASTM D2240 |
Thermal
DTUL at 66psi — Unannealed | 169 °F |
76 °C | ASTM D648 |
Brittleness Temperature | < ‑105 °F |
< ‑76 °C | ASTM D746 |
Tensile Impact Strength | 40 ft·lb/in² |
84.1 kJ/m² | ASTM D1822 |
Disclaimer
The information presented in this document is believed to be accurate as of the date of publication. However, it is provided for general informational purposes only. It does not imply any express or implied warranty or quality specification, including but not limited to warranties of merchantability or fitness for a particular purpose. Users are solely responsible for independently assessing whether the product is suitable for their intended use and ensuring that it can be used safely and in compliance with relevant laws and regulations. We expressly disclaim liability for any loss, damage or injury directly or indirectly suffered or incurred as a result of or related to anyone using or relying on any of the information in this document.
Nota:
Esto es una traducción. Quantum no asume responsabilidad alguna por la exactitud de la traducción. Cualquier discrepancia o diferencia creada en la traducción no es vinculante y no tiene ningún efecto legal. Si surge alguna duda relacionada con la exactitud de la información contenida en la ficha técnica traducida, consulte la versión en ingles.