Qplast™
QPHD P0760
High Density Polyethylene
Qplast™ QPHD P0760 is a high-density homopolymer polyethylene with a medium molecular weight distribution. It provides superior processing consistency and results in bottles with outstanding appearance and rigidity. QPHD P0760 delivers the highest barrier properties available in high-density polyethylene, while minimizing odor and taste transfer to the packaged product.
- Supplier
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Additive
Thermal Stabilizer: Yes; Antistatic: No
Applications
- Liquid Food Containers
- Food Packaging
- Thermoformed Parts
Form(s)
Pellets
Resin Properties
Typical Value (English) |
Typical Value (SI) |
Test Method |
|
---|---|---|---|
Density | 0.963 g/cm³ |
0.963 g/cm³ | ASTM D1505 |
Melt Index (190°C/2.16 kg) | 0.70 g/10 min |
0.70 g/10 min | ASTM D1238 |
Peak Melting Temperature | 273 °F |
137 °C | Proprietary Method |
Molded Properties
Tensile Strength at Yield | 4700 psi |
32 MPa | ASTM D638 |
Tensile Strength at Break | 2200 psi |
15 MPa | ASTM D638 |
Elongation at Yield | 8 hr |
8 hr | ASTM D638 |
Flexural Modulus | ASTM 790 | ||
1% Secant 2% Secant |
185000 160000 psi psi |
1276 1100 MPa MPa | |
Environmental Stress-Crack Resistance100% Igepal | 8 hr |
8 hr | ASTM D1693B |
Durometer Hardness (Shore D, 15 sec) | 64 |
64 | ASTM D2240 |
Charpy Notched Impact Strength | ISO 179/1eA | ||
-4°F (-20°C) 73°F (23°C) |
3.5 5 ft-lb/in² ft-lb/in² |
7 10 kJ/m² kJ/m² |
Disclaimer
The information presented in this document is believed to be accurate as of the date of publication. However, it is provided for general informational purposes only. It does not imply any express or implied warranty or quality specification, including but not limited to warranties of merchantability or fitness for a particular purpose. Users are solely responsible for independently assessing whether the product is suitable for their intended use and ensuring that it can be used safely and in compliance with relevant laws and regulations. We expressly disclaim liability for any loss, damage or injury directly or indirectly suffered or incurred as a result of or related to anyone using or relying on any of the information in this document.
Nota:
Esto es una traducción. Quantum no asume responsabilidad alguna por la exactitud de la traducción. Cualquier discrepancia o diferencia creada en la traducción no es vinculante y no tiene ningún efecto legal. Si surge alguna duda relacionada con la exactitud de la información contenida en la ficha técnica traducida, consulte la versión en ingles.