Qplast™
QPHJ 205 Series
High Density Polyethylene
Qplast™ QPHJ 205 is a narrow molecular weight hexene copolymer tailored for a broad spectrum of injection molding applications. It offers excellent processability along with strong toughness properties, making it ideal for products requiring low warpage, glossy finishes, and resistance to impact at low temperatures.
- Supplier
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Additive
QPHJ 205A: Antioxidant: yes
QPHJ 205A.AS: Antistatic: yesApplications
- Food Packaging Containers
- Lawn & Garden Accessories
- Houseware Articles
- Soda Carrier Totes
- Toys
Resin Properties
Typical Value (English) |
Typical Value (SI) |
ASTM D1505 |
|
|---|---|---|---|
| Density | 0.952 g/cm³ |
0.952 g/cm³ | ASTM D1505 |
| Melt Index (190°C/2.16) | 19 g/cm³ |
19 g/cm³ | ASTM D1238 |
| Peak Melting Temperature | 267 °F |
131 °C | Proprietary Method |
Thermal
| Deflection Temperature Under Load (DTUL) at 66psi — Unannealed |
164 °F |
73 °C | ASTM D648 |
| Deflection Temperature Under Load (DTUL) at 264psi — Unannealed |
114 °F |
46 °C | ASTM D648B |
Molded Properties
| Tensile Strength at Yield | 3700 psi |
26 MPa | ASTM D638 |
| Elongation at Break | 270 % |
270 % | Proprietary Method |
| Flexural Modulus1% Secant 2% Secant |
179000 159000 psi psi |
1234 1096 MPa MPa | ASTM D790B |
| Environmental Stress-Crack Resistance10% Igepal | 3 hr |
3 hr | ASTM D1693B |
Impact
| Notched Izod Impact (-40°F (-40°C)) | 0.61 ft·lb/in |
32 J/m | ASTM D256 |
Disclaimer
The information presented in this document is believed to be accurate as of the date of publication. However, it is provided for general informational purposes only. It does not imply any express or implied warranty or quality specification, including but not limited to warranties of merchantability or fitness for a particular purpose. Users are solely responsible for independently assessing whether the product is suitable for their intended use and ensuring that it can be used safely and in compliance with relevant laws and regulations. We expressly disclaim liability for any loss, damage or injury directly or indirectly suffered or incurred as a result of or related to anyone using or relying on any of the information in this document.
Nota:
Esto es una traducción. Quantum no asume responsabilidad alguna por la exactitud de la traducción. Cualquier discrepancia o diferencia creada en la traducción no es vinculante y no tiene ningún efecto legal. Si surge alguna duda relacionada con la exactitud de la información contenida en la ficha técnica traducida, consulte la versión en ingles.