Qplast™
QPHJ 860U
High Density Polyethylene
Qplast™ QPHJ 860A is a high density homopolymer resin known for its exceptional stiffness, combined with a strong balance of processability and impact resistance at low temperatures. This resin is ideally suited for applications that need high stiffness or enabling down-gauging. It also delivers superior performance in structural foam applications.
- Supplier
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Additive
Antioxidant: Yes; UV Stabilizer: Yes
Applications
- Cases
- Hot Fill Packaging Pails
- Pallets
- Totes Bins
- Crates
Resin Properties
Typical Value (English) |
Typical Value (SI) |
ASTM D1505 |
|
|---|---|---|---|
| Density | 0.965 g/cm³ |
0.965 g/cm³ | ASTM D1505 |
| Melt Index (190°C/2.16 kg) | 8.0 g/10 min |
8.0 g/10 min | ASTM D1238 |
| Peak Melting Temperature | 275 °F |
135 °F | ASTM D1238 |
Thermal
| Deflection Temperature Under Load (DTUL) at 66 psi — Unannealed |
189 °F |
87 °C | ASTM D648 |
| Deflection Temperature Under Load (DTUL) at 264 psi — Unannealed |
119 °F |
49 °C | ASTM D648B |
Molded Properties
| Tensile Strength at Yield | 4300 psi |
30 MPa | ASTM D638 |
| Elongation at Break | 440 % |
440 % | ASTM D638 |
| Flexural Modulus | ASTM D790B | ||
| 1% Secant 2% Secant |
270000 230000 psi psi |
1900 1600 MPa MPa | |
| Environmental Stress-Crack Resistance10% Igepal | 3 hr |
3 hr | ASTM D1693B |
| Notched Izod Impact (-40°F (-40°C)) | 0.89 ft·lb/in |
47 J/m | ASTM D256 |
Disclaimer
The information presented in this document is believed to be accurate as of the date of publication. However, it is provided for general informational purposes only. It does not imply any express or implied warranty or quality specification, including but not limited to warranties of merchantability or fitness for a particular purpose. Users are solely responsible for independently assessing whether the product is suitable for their intended use and ensuring that it can be used safely and in compliance with relevant laws and regulations. We expressly disclaim liability for any loss, damage or injury directly or indirectly suffered or incurred as a result of or related to anyone using or relying on any of the information in this document.
Nota:
Esto es una traducción. Quantum no asume responsabilidad alguna por la exactitud de la traducción. Cualquier discrepancia o diferencia creada en la traducción no es vinculante y no tiene ningún efecto legal. Si surge alguna duda relacionada con la exactitud de la información contenida en la ficha técnica traducida, consulte la versión en ingles.